OUR SERVICES


With a constant drive for miniaturization, higher speed and lower cost, chip manufacturing is an ongoing challenge that pushes the engineering envelope. For the entirety of our history, semiconductor production equipment has been one of our strong suits. Both in front-end and back-end as well as in metrology and measurement tools. We have a long track record, developing and realizing customized modules and machines for many of the world’s biggest OEM’s in semicon equipment. Our scope stretches from positioning and deposition modules to mask and wafer inspection tools, extending to advanced packaging solutions.
We offer end-to-end engineering as a service for semicon manufacturing equipment, from early-phase research and concept development to prototyping, validation and production. Customers can pick and choose the extent of our involvement. We will balance out performance, cost of ownership and time to market, according to your specific demands.
With our experience in developing positioning systems for semiconductor equipment for the EUV node, we have developed a technology platform. This platform consists of a library of technologies, components and sub-modules that can be combined into a customized ultra-high precision substrate positioning system. The availability of these libraries strongly reduces the development time and costs of customized nanometer-precision stages.

Demcon offers end-to-end engineering as a service for semicon manufacturing equipment, from early-phase research and concept development to prototyping, validation and production. Customers can pick and choose the extend of our involvement. We will balance out performance, cost of ownership and time to market, according to your specific demands.
We believe in the power of partnerships. So, to deliver as promised, we combine expertise, experience, and domain knowledge to create a winning team. Working side-by-side, creating shared value.



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Exposing a component to a very high heat load is complex. Especially when the component is the size of a straw. To make sure the component actually survives this volumetric heat load Demcon developed a setup that can simulate the actual heat load on a similar component.
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After shipment of forty million coins from the Netherlands to their destination country, it appeared that an estimated one percent of the coins showed missing chips and discoloration. An on-site sorting machine was urgently required and Demcon built it within four weeks.
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