Optical inspection and metrology systems are used throughout semiconductor manufacturing to detect defects, measure critical process parameters, and monitor process stability. These platforms employ technologies such as brightfield and darkfield imaging, laser scanning, confocal metrology, interferometry, scatterometry, and spectroscopic ellipsometry.

Demcon offers a wide range of expertise in optical design, precision mechatronics, system integration and advanced algorithms

Electron-beam systems provide the resolution required to inspect and measure features beyond the limits of optical techniques. Applications include wafer inspection, defect review, reticle inspection, and critical dimension metrology. These systems combine electron optics, vacuum technology, precision positioning, and advanced signal processing.

Demcon has unique expertise in the design of modules for e-beam systems, such as high-precision stages, magnetic shielding, wafer clamping, high-voltage modules and test rigs

Atomic Force Microscopy (AFM) enables nanometer- and sub-nanometer-scale measurement of surface topography, roughness, and material properties. AFM is widely used for process development, reference metrology, and characterization of advanced semiconductor structures.

Demcon contributes through ultra-stable mechanical architectures, precision mechatronics, sensor integration and control design for highly sensitive measurement equipment

Advanced packaging technologies such as chiplets, hybrid bonding, 2.5D integration, and 3D stacking introduce new challenges in alignment, bond quality, warpage, and defect detection. Inspection and metrology systems combine optical imaging, confocal metrology, interferometry, X-ray imaging, and CT scanning to ensure yield and reliability.

Demcon develops the precision mechatronic, optical, and system-level solutions needed for these increasingly complex platforms.

Future semiconductor devices and manufacturing nodes require entirely new measurement approaches. Emerging platforms increasingly combine multiple technologies, including optical metrology, e-beam imaging, AFM, X-ray techniques, and AI-driven data analysis.

Demon helps customers translate novel concepts into scalable systems through simulation, proof-of-concept development, system engineering, and realization of first-of-a-kind metrology equipment. Our expertise extends from conventional semiconductor inspection equipment, to emerging fields such as quantum chips (solid-state qubits), including position control, alignment and probing at cryogenic temperatures.