In this article, we present the model-based design steps for a high-performance vibration isolation system to support a metrology frame.
From June 17 to 19, 2026, Demcon high-tech systems will be present at the SEMI 3D & Systems Summit in Dresden, Germany. This summit brings together semiconductor packaging leaders to explore the strategies and technologies driving next-generation heterogeneous systems integration.
About
As chip architectures grow more complex, heterogeneous integration has become one of the defining challenges in semiconductor manufacturing. The SEMI 3D & Systems Summit addresses this complexity head-on. This year's theme, Enabling Next-Gen Heterogeneous Systems Integration, brings together industry leaders to discuss chiplet architectures, hybrid bonding, co-packaged optics, and AI-driven system architectures, with a strong focus on Europe's role in advancing design leadership and the transition from research to fabrication.
Demcon high-tech systems will be present at this event. With decades of experience developing customized modules and machines for semiconductor manufacturing equipment, our multidisciplinary teams work across the full development chain - from early-phase research to prototyping, validation, and customers' systems. We support both first-of-a-kind development and industrialization of complex modules.
The challenges we solve
Precision positioning and metrology
Developing nanometer-precision positioning systems and qualification tools for wafer and module handling, ensuring functional and mechanical performance is validated across hundreds of parameters before system integration.Thermal and mechanical design
Designing and analyzing modules for high-density integrated systems where thermal loads, mechanical stability, and dynamic behavior must be carefully balanced from the earliest design phase.Dynamics and control
Developing and integrating advanced control architectures to support high-accuracy processes, including active vibration isolation and real-time control across multiple degrees of freedom.Multiphysics simulation and model-based design
Using simulation early in development to validate concepts, predict system behavior, and reduce risk before hardware is built. This covers mechanical, thermal, and control domains simultaneously.
Connect with us at 3D & Systems Summit
Will you be attending the summit? We would love to connect. Send us a message if you would like to meet up. Find more information on the event here.
Project highlight
Heterogeneous integration demands rigorous module qualification before system integration. For a semiconductor qualification tool, we developed a high-performance vibration isolation system achieving 8 to 10 orders of magnitude disturbance attenuation across 100 to 5,000 Hz.
Read more about the project here:
