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Published on: April 6, 2026

AP international conference

On 20–22 April, we will visit the Advanced Packaging International conference in Brussels, Belgium. The event focuses on advanced packaging technologies that enable the next generation of semiconductor and photonics systems. As part of AngelTech, the conference brings together multiple technology domains, including photonic integration and system level packaging.

About
Advanced Packaging International addresses how heterogeneous integration, thermal management, and packaging architectures are shaping future high performance systems. These themes closely connect to photonics, where optical, mechanical, and thermal performance must be carefully balanced at system level.

Demcon high-tech systems and Demcon focal support this complexity through integrated engineering across optics, optomechanics, electronics, software, and thermal design, enabling reliable photonics systems that can move toward industrial deployment.

The challenges we solve

  • Optical design & alignment
    We design optomechatronic modules in which optical performance, positioning accuracy, and mechanical stability are integrated from the earliest design stages.

  • Metrology & thermal control
    Drawing on experience from semiconductor and aerospace domains, we address mechanical rigidity and thermal stability, which are essential for advanced packaging and photonic reliability.

  • Electronics & control systems
    We develop control systems for active alignment, vibration isolation, and adaptive optics, supporting stable operation in densely integrated packages.

  • Software & simulation
    Multiphysics simulations are used to assess thermal, mechanical, and optical behavior early in development, supporting design decisions for complex packaging architectures.


Connect with us at Advanced Packaging International
We look forward to visiting Advanced Packaging International in Brussels and exchanging insights on advanced packaging and photonics enabled system integration.

Find more information on the AP International conference here.

Recent highlight
The focus of Advanced Packaging International on thermal management, reliability, and system integration aligns closely with real world photonics challenges. A recent project by Demcon focal, in collaboration with TNO, involved delivering high precision optical performance for the world’s largest telescope. This work demonstrates how mechanical stability, thermal control, and metrology come together in demanding optomechatronic systems.

Read the full article here:

TNO and Demcon focal provide the world’s largest telescope with sharp vision

TNO and Demcon focal provide the world’s largest telescope with sharp vision

Delivery of first Laser Projection System to European Southern Observatory Technology developer and producer Demcon shipped the first Laser Projection System together with TNO last week. Its destination is the European Southern Observatory (ESO), where TNO and ESO will test the system. In total, Demcon company Focal and TNO will build nine systems for ESO’s Very Large Telescope and Extremely Large Telescope in Chile. The systems project ‘laser guide stars’ into the atmosphere to help the large telescopes better focus on distant astronomical objects. This gives astronomers sharper images of the universe. They hope to make new discoveries, for example about the evolution of the universe after the Big Bang and the formation of stars and galaxies.

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